Lattice Semiconductor to Present Its Smart Connectivity Solutions

21. August 2017, 08:53 Uhr
...at the First Mobile World Congress Americas 2017  

Who:        Lattice Semiconductor Corporation (NASDAQ: LSCC), the leading provider of customizable smart connectivity solutions.
 
What:       Experience the latest innovations in smart connectivity solutions from Lattice Semiconductor and learn how Lattice’s FPGA and wireless technologies solve increasing demands of the consumer, mobile and communications markets.
 
When:      Tuesday, September 12, 2017                         (9 a.m. – 5 p.m.)
                  Wednesday, September 13, 2017                  (9 a.m. – 5 p.m.)
                  Thursday, September 14, 2017                      (9 a.m. – 5 p.m.)
 
Where:     Moscone Center
                  West Hall, Booth #W-301
                  800 Howard Street
                  San Francisco, CA 94107
 
 
Product demonstrations include:
 
  • Consumer & Mobile – Lattice products are being used in the most popular consumer and mobile products. Visit our booth to see what is driving the demand for Lattice solutions in smartphones, VR and other exciting product categories!
We will be demonstrating our CrossLink™ FPGA video bridging and signal aggregation solutions for camera and Edge applications, the iCE40 UltraPlus™ FPGA for emerging mobile applications, and our SiBEAM Snap™ wireless connector replacement technology.
 
  • Communications – Find out more about 60 GHz wireless infrastructure solutions based on our SiBEAM® technology, which address the need for high capacity wireless links in urban Wi-Fi, LTE and fixed wireless broadband networks.
 

For editors interested in meeting with Lattice during Mobile World Congress Americas, please contact Lattice@racepointglobal.com. To schedule a customer meeting, please visit: http://www.latticesemi.com/en/About/ContactUs.aspx.

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