The LDBL20’s bumpless STSTAMP™ package breaks through the minimum I/O-area and height limitation imposed by the diameter of traditional flip-chip solder bumps, enabling unprecedentedly small footprints and low mounted heights. The LDBL20 extends ST’s family of compact LDOs, which includes devices from 2mm x 2mm DFN to a 0.69mm x 0.69mm CSP with 300mA output.
In addition to its size advantage, the LDBL20 is an outstanding performer. The 200mA output makes it as powerful as larger devices from other manufacturers. The input voltage can range from 1.5V to 5.5V, with 200mV typical dropout. Rejection (PSRR) of 80dB at 100Hz and 50dB at 100kHz simplifies filtering over a wide frequency range to provide a stable rail for low-power circuitry in battery-operated applications. Quiescent current of 20µA no-load, 100µA full-load, and 0.3µA in standby help maximize efficiency under all operating conditions.
A wide range of output voltages is available on request, from 0.8V up to 5.0V in 50mV increments. Designers can also take advantage of built-in features of the LDBL20, which include logic-controlled electronic shutdown, internal soft-start, and support for active output-voltage discharge if required.
An evaluation board for the LDBL20, STEVAL-ISB034V1, is also available, which assists design-in to a wide range of products such as fitness and blood-pressure monitors, glucose meters, hearing aids, wearable sensors, smart headphones, portable audio devices, smart plugs, smart watches, and smartcards.
The LDBL20 is in production now, priced from $0.25 for orders of 1,000 pieces.
For further information please visit the product information page at www.st.com.